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簡要描述:用Dyesol的兩部分連接在Dyesol的兩部分中性組裝聚合物結(jié)合聚合物創(chuàng)造系列玻璃基板之間的導(dǎo)電連接連接DSC瓷磚。
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Dyesol’s Two Part Interconnect Polymer is a black, flexible neutral curing conductive material formulated to provide a series connection, in conjunction with Dyesol’s Two Part Neutral Assembly Polymer, as part of the primary sealing component in Dye Solar Cell prototype tiles. The formulation utilises tungsten metal to achieve conductivity and the cured material exhibits excellent chemical stability. Curing will occur at 50°C with accelerated curing times achieved with temperatures up to 80°C.——Dyesol的兩部分連接的聚合物是一個(gè)黑色的、靈活的中性固化導(dǎo)電材料配方,提供一系列的連接,在與Dyesol的兩部分中性聚合物連接組件,作為染料太陽能電池原型磚的主要密封部件的一部分。配方采用鎢金屬實(shí)現(xiàn)電導(dǎo)率和固化材料具有優(yōu)良的化學(xué)穩(wěn)定性TY。固化將發(fā)生在50°C與加速固化時(shí)間達(dá)到溫度高達(dá)80°C.
To ensure the tungsten component of the formulation remains evenly suspended the syringes must be shipped in dry ice which incurs an additional shipping fee.
To ensure the tungsten component of the formulation remains evenly suspended during storage the syringes require rotation. Dyesol offers a Syringe Carousel for this purpose.
Consider also purchasing: Dyesol’s Two Part Hermetic Sealing Compound, Two Part Neutral Assembly Polymer, Primary Seal & Interconnect Dispenser, Tile Assembly & Jigging, and Syringe Carousel.
ITEM # | SIZE |
MS004685 | 50 grams |
Quantities: | 65ml as a pre-loaded syringe suitable for use in Dyesol’s Primary Seal & Interconnect Dispenser |
Curing Temperature: | 50-80°C |
Mixing Ratio: | By volume 1:1 |
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